Ultrasmall‐Bandgap Tellurium Nanowire‐Based Photothermal Superhydrophobic Coating With Biomimetic 3D Thermal Network for Energy‐Autonomous Anti‐/De‐Icing
Chengjin Zhang, Ke Pei, Wentao Zhou, Yongshen Zhou, Zhiwen Zhou, Linghai Zhang, Zhengchi Yang, Jinwei Gao, Xinyu Wang, Zhiguang GuoABSTRACT
Efficient anti‑/de‑icing coatings are urgently needed for outdoor infrastructures in cold climates. Here, we report a photothermal superhydrophobic coating based on ultrasmall‑bandgap tellurium nanowires (TeNWs, E g = 0.43 eV) synthesized via a surfactant‑assisted solid‑solid‑solid growth strategy. The composite, integrating TeNWs with fluorinated diatomite, constructs a continuous three‑dimensional thermal conduction network that synergistically enhances light absorption, heat transfer, and water repellency. The optimized coating achieves an exceptional solar‑thermal conversion efficiency of 92.02%, owing to strong electron‑phonon coupling (λ = 2.47) enabled by bandgap engineering, as revealed by first‑principles simulations. This biomimetic 3D network further yields a high thermal conductivity of 0.857 Wm −1 K −1 , a 306% enhancement over the matrix. Under harsh conditions (−20°C, 70% RH), it delays ice formation for 480 ± 32 s, maintains an ultralow ice adhesion strength of 17.4 ± 2.6 kPa, and under one‑sun irradiation, rapidly raises the surface temperature to 89.6°C to achieve complete de‑icing within 283 ± 23 s. Practical tests on aluminum cables, aircraft wings, and wind‑turbine blades demonstrate its versatility and durability. This work establishes a design paradigm integrating semiconductor photophysics with biomimetic engineering for scalable, high‑efficiency photothermal anti‑/de‑icing materials.