Thermomechanical Finite Element Techniques in Multilayer Ceramic Package Design

Critical to the design of any multilayer ceramic

package, is the thermal expansion mismatch that takes

place during solder/brazing between components. This

CTE mismatch produces residual elastic strain in the

ceramic that, depending on the severity, can lead to

hermetic failure. In the present work, ANSYS finite

element software has been coupled with CARES statistical

reliability software to provide a design methodology for

the development of geometrically complex microelectronic

packages.