Thermal Characteristics for LSI Embedding Build-up PWBs

Electronics manufactures work over with developing the performance, multiplying the function and downsizing of electronics modules with the high-density jisso technology. The authors carry out developing LSI embedding build-up PWBs with simultaneous laminate process as a forced solution. On the other hand, the high-density jisso technology brings heat issues. This paper reports the thermal characteristic for LSI embedding build-up PWBs on thermal simulation; 1) estimating thermal property of current LSI embedding build-up PWBs, 2) study of thermal conductivity on material on improving the thermal performance, 3) heat spreading along metal layers in build-up PWBs, 4) effect of embedded heat spreader. The authors succeed to improve thermal performance by 28% in comparison to conventional PWB structure.