DOI: 10.31399/asm.edfa.2023-3.p054 ISSN: 1537-0755
The EDFAS FA Technology Roadmap Die-Level Post-Isolation Domain Technical Summary
Chuan Zhang- Electrical and Electronic Engineering
- Safety, Risk, Reliability and Quality
Abstract
The Electronic Device Failure Analysis Society established the Die-Level Post-Isolation Domain Council to provide an overview of the upcoming challenges in this area and guide technique developments for next-generation analytical tools. This column summarizes the findings of the council in the areas of sample preparation, microscopy, nanoprobing, circuit editing, and scanning probe microscopy. It is a preview of the full roadmap document, which is in preparation to be released to the EDFAS community.