DOI: 10.4071/001c.171418 ISSN: 2380-4505
The Critical Role of Hybrid Bonding in driving Architectures for AI and High Performance Computing
Vineeth Reddy Bijjam, Thomas PleschkeThe relentless growth of AI workloads is pushing semiconductor packaging to its physical limits. To sustain performance gains, the industry must move beyond traditional packaging toward 3D stacking. This presentation highlights hybrid bonding as the key catalyst for this transition. By eliminating solder bumps and enabling ultra-fine pitch interconnects, hybrid bonding unlocks new possibilities for HBM integration and Co-Packaged Optics (CPO), drastically reducing the “memory wall” and I/O power consumption. These architectural shifts are essential for scaling AI accelerators and HPC systems to meet the computational demands of the next decade.