The Cleaning Effectiveness in Electronics Assembly Process

This paper deals with research and development of the cleaning process conditions regarding the efficiency of practical cleaning methods in the area of electronics assembly technologies, target the cleaning after lead-free soldering. Increased miniaturization, higher speeds and tighter board space highlights that need, as well as request for higher reliability, especially by some type of applications (automotive, medical, military etc.).

Correct adjustment of the cleaning equipment and cleaning process may save as the time as well materials consumption and costs. In this paper are discussed some parameters of cleaning process, especially cleaning medium, including its optimal controlling and setting. The special test pattern on glass substrate were designed

and realized to become a “scale” for measuring cleaning efficiency. This pattern was used for optimal arrangement and adjustment new cleaning equipments, which are developing in Pbt Roznov Company in the Czech Republic [4]. Latest work is focused on cleaning medium controlling in the practical use. In more with

introduction of new environmental regulations (WEEE, RoHS) and also eco-design (EuP) rules the cleaning process becomes to be more and more important, not only for lead free soldering as well for various parts of technological processes.