Synergistic Time‐Delay Integration X‐Ray Imaging with Pixelated Cs 3 Cu 2 I 5 Scintillators for H
Jianwei Gong, Xiaoke Huang, Xiaoze Wang, Xiaokun Li, Zhijian Yang, Qinxia Wu, Xiaoling Chen, Tingting Wu, Zhenzhen Zhang, Yu He, Qiushui Chen, Xiaodan Wu, Xiaofeng Chen, Huanghao YangABSTRACT
The longstanding trade‐off between spatial resolution and detection sensitivity has hindered X‐ray imaging in high‐speed nondestructive testing. Here, we present a synergistic strategy that integrates time‐delay integration (TDI) linear scanning with a waveguide‐structured pixelated Cs 3 Cu 2 I 5 scintillator array to overcome this limitation. The pixelated architecture effectively suppresses lateral photon scattering while maintaining high light output from a 400‐µm‐thick scintillator layer, achieving a spatial resolution of 27.9 lp mm −1 in X‐ray imaging. By incorporating a multistage TDI configuration, we amplify the collected scintillation photons without compromising spatial resolution, achieving a 29.8‐fold enhancement in sensitivity. Notably, the TDI‐based linear scanning system supports a continuous high‐speed readout rate of 22.3 mm s −1 , enabling real‐time, high‐fidelity X‐ray chip inspection with a throughput exceeding 130 chips per minute. This work establishes a viable pathway for advancing X‐ray imaging toward high‐precision and real‐time X‐ray inspection.