Study on Heat Partition in Sliding Contact Pairs Considering Conduction Heat Flux

Regarding heat conduction in sliding contact pairs, this paper investigates the interfacial heat partition problem with conduction heat flux taken into account to address the issue of the heat partition coefficient falling outside its physically reasonable range. The main contributions of this study are as follows. First, conduction heat flux is explicitly introduced, and the governing equation for the heat partition coefficient incorporating conduction heat flux is derived via Green’s function method. Subsequently, to tackle the nonlinearity caused by the time-varying velocity and heat source of the contact pair, least-squares estimation is adopted to solve for the heat partition coefficient and conduction heat flux. The results indicate that under extreme operating conditions with drastic variations in heat source and velocity, traditional heat partition models yield unphysical results where the heat partition coefficient is less than 0 or greater than 1, whereas the modified model effectively resolves this issue. Furthermore, this paper analyzes the effects of material parameters, motion characteristics, and thermal loads on heat partition. The findings of this work provide a reference for interfacial thermal design and thermal management of various sliding contact pairs.