Solution-Processed Nanocomposite GO−AgNPs/AgNWs Transparent Conductive Films for Multifunctional Flexible Optoelectronics

Abstract

As application scenarios and usage conditions become increasingly complex, traditional indium tin oxide materials are limited in meeting diverse application demands due to their low flexibility and high cost. This study proposed a ternary nanocomposite strategy combining zero-dimensional AgNPs, one-dimensional AgNWs, and two-dimensional graphene oxide (GO) nanosheets to fabricate transparent conductive films (TCFs) with excellent environmental stability and optoelectronic properties, suitable for applications such as Joule heating, electromagnetic interference (EMI) shielding, and organic light-emitting diode (OLED) devices. By growing AgNPs in situ on the surface of GO, combined with a simple solution-processing technique and integration with silver nanowires (AgNWs), this study developed GO-AgNP/AgNW TCFs featuring a dual-layer structure. Test results showed that the TCF achieved a sheet resistance of 2.98 Ω/sq, a light transmittance of 78.6% at 550 nm, a haze of 11.5%, and a figure of merit of 0.0302 Ω−1. The TCF also exhibited outstanding environmental stability, with no significant change in resistance after 50 days of aging tests. When used as a Joule heating device, it reached a maximum temperature of 110 °C under a working voltage of 2.5 V, demonstrating a fast thermal response. As an EMI shielding device, it achieved a shielding effectiveness of 27 dB in the X-band (8.2−12.4 GHz). Notably, when employed as the anode in OLED devices, the GO-AgNP/AgNW TCF enabled excellent electroluminescent performance, achieving a maximum luminance (Lmax) of 10,000 cd/m2, a maximum current efficiency (C.E.max) of 12.4 cd/A, a maximum power efficiency (P.E.max) of 5.6 lm/W, and a maximum external quantum efficiency (EQEmax) of 3.7%. This work provides a scalable approach for developing TCFs with simple fabrication processes, superior environmental stability, and multifunctionality, effectively meeting the demands of complex and dynamic application environments.