Solder Jetting - A Versatile Packaging and Assembly Technology for Hybrid Photonics and Optoelectronical Systems

Solder Jetting is a versatile assembly and packaging technology for hybrid photonics and MEMS. The jetting device for liquid solder droplets ranging from 100 μm to 760 μm in diameter is manipulated in up to 6DOF independently from the complex assembly environment, thus able to reach even complex and 3D-shaped joining geometries. Creating the joint between the component and the system platform the metallic solder alloy is advantageous over standard adhesives due to better temperature, radiation and long term stability, making it favourable e.g. for high power photonics applications and also serving for electrical and thermal conductivity. In various photonics applications alignment stability up to 1.5±0.5 μm have been demonstrated.