Simulation and Comprehensive Analysis of AlGaN/GaN HBT for High Voltage and High CurrentXinyuan Wang, Lian Zhang, Jiaheng He, Zhe Cheng, Zhe Liu, Yun Zhang
- Electrical and Electronic Engineering
- Computer Networks and Communications
- Hardware and Architecture
- Signal Processing
- Control and Systems Engineering
We present a series of TCAD analysis of gallium nitride (GaN) heterojunction bipolar transistors (HBTs) that investigates the impact of various key parameters on the gain characteristics, output characteristics, and breakdown characteristics. It has been observed that the DC gain of the AlGaN/GaN HBTs exhibits a non-linear relationship with the increase in the Al fraction. Specifically, the DC gain initially rises, then declines after reaching its peak value at approximately 7%. By optimizing the concentration of the base and the concentration and thickness of the collector epitaxial layer, it is possible to achieve devices with breakdown voltages of 1270 V (with a collector thickness of 6 μm and a carrier concentration of 2 × 1016 cm−3), specific on-resistance of 0.88 mΩ·cm2, and a current gain of 73. In addition, an investigation on breakdown characteristics is conducted for HBTs with two types of substrates, namely QV-HBTs and FV-HBTs, at different inclinations of the ramp. We propose that critical angles are 79° and 69° to prevent the surface breakdown of the device, which helps to achieve an avalanche in GaN HBTs. We anticipate that the aforementioned findings will offer valuable insights for designing GaN-based power HBTs with elevated breakdown thresholds, heightened current densities, and increased power capabilities.