DOI: 10.1039/d6ta04364j ISSN: 2050-7488
Scale-up and electrochemical validation of Fe-modified Mn–Cu spinel coatings deposited by electrophoretic deposition for solid oxide cell interconnect applications
Francesco Gallo, Simone Anelli, Fabiana D'Isanto, Xiufu Sun, Marco Castelli, Antonio Gianfranco Sabato, Albert Tarancón, Federico SmeacettoCobalt-free Mn–Cu spinel coatings, with and without Fe modification, were deposited by electrophoretic deposition (EPD) and comparatively evaluated as protective layers for solid oxide cell (SOC) interconnects.