Quasi‐Standard Platform of AlScN Piezoelectric Integrated MEMS Technology (PIMT) For Multi‐Project Wafer Fabrication
Yongquan Su, Yuqiang Hu, Xingwang Zhu, Wenli Xue, Hao Huang, Yichen Liu, Jiachen Han, Anna Li, Cheng Zhang, Wanzhu Qiao, Jiaqi Huang, Peng Ding, Qianying Sun, Huan Liu, Tao Wu, Lihao Wang, Yang Wang, Hao Chen, Zhenyu WuABSTRACT
Piezoelectric MEMS devices are a key branch of MEMS technology, valued for high integration, miniaturization, stability, and reliability. However, existing standardized manufacturing struggles to meet diverse design and R&D needs. This paper presents an 8‐inch quasi‐standard Piezoelectric Integrated MEMS Technology (PIMT) platform for Multi‐Project Wafer (MPW) fabrication, integrating core processes and supporting additional ones to adapt to different device requirements. After three tape‐out iterations, the platform now centers on three core processes with supplementary ones. This paper details all the process modules, process windows, and design rules in PIMT. Through process control monitoring (PCM), it ensures that key process steps are accurately processed. It also presents the key performance of different types of MEMS devices produced by the PIMT platform in three rounds and elaborates on the influence of the most influential process steps on device performance. This platform accelerates R&D prototyping efficiently.