Prognostication For Impending Failure in Leadfree Electronics Subjected to Shock and Vibration Using Resistance Spectroscopy

Leading indicators of failure have been developed based on high-frequency characteristics, and system-transfer function derived from resistance spectroscopy measurements during shock and vibration. The technique is intended for condition monitoring in high reliability applications where the knowledge of impending failure is critical and the risks in terms of loss-of-functionality are too high to bear. The high-frequency characteristics, and system transfer function based on resistance spectroscopy measurements have been correlated with the damage progression in electronics during shock and vibration. Packages being examined include ceramic area-array packages. Second level interconnect technologies examined include copper-reinforced solder column, SAC305 solder ball, and 90Pb10Sn high-lead solder ball. Assemblies have been subjected to 1500g, 0.5 ms pulse. A positive prognostic distance has been demonstrated for each of the interconnect technologies tested.