Preparation and Comprehensive Properties of CeO2-Doped Composite Copper Foils

In the field of flexible electronics, traditional composite copper foils generally suffer from weak interfacial adhesion between the copper layer and polymer substrate, poor corrosion resistance, insufficient surface uniformity, and limited functional adaptability. To address these issues, Cu/Cu-CeO2 composite coatings were deposited on polyimide (PI) substrates via PVD magnetron sputtering using argon as the working gas, aiming to enhance the comprehensive properties of composite copper foils, including interfacial bonding strength and corrosion resistance. Initially, pure Cu coatings were deposited on polyimide (PI), polyethylene terephthalate (PET), and polypropylene (PP) substrates. The deposition parameters were optimized through orthogonal and single-factor experiments, and the optimal process combination was determined as follows: PI substrate, sputtering time of 20 min, sputtering power of 60 W, and argon flow rate of 90 sccm, which achieved a balance between mechanical and electrical properties. Subsequently, comparative studies of Ar plasma treatment (100 s, 200 s, 300 s, and 400 s) and NaOH chemical etching (0 mol/L, 1 mol/L, 2 mol/L, and 3 mol/L) were conducted on the three polymer substrates. Comprehensive analyses of water contact angle, surface energy, bonding strength, and surface roughness demonstrated that the PI substrate treated with Ar plasma for 300 s exhibited superior overall performance, with a water contact angle of 48.5°, surface energy of 61.78 × 10−3 J/m2, bonding strength of 4.56 N, and surface roughness of 0.89 μm. On this basis, the performance of pure Cu coatings and Cu/Cu-CeO2 composite coatings prepared under different CeO2 sputtering powers (20 W, 30 W, 40 W, and 50 W) was further investigated. Combined analyses of SEM, EDS, and XPS characterizations, together with bonding strength, resistivity, electrochemical impedance spectroscopy, polarization curves, and corrosion morphology tests, revealed that the Cu/Cu-CeO2 composite coating prepared at a sputtering power of 50 W exhibited superior overall performance in terms of interfacial bonding strength and corrosion resistance.