Polymer Nanocomposites, Printable and Flexible Technology for Electronic Packaging

Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Nanocomposites will play an important role for developing advanced printable and flexile technology. Advanced printing is a relatively new technology and needs more characterization and optimization for practical applications. In the present paper, the use of nanocomposites or materials in the area of printable and flexible technology is examined. A variety of printable nanomaterials for electronic packaging has been developed. This includes nano capacitors and resistors. Nanocomposites can provide high capacitance densities, ranging from 5 nf/inch2 to 25 nF/inch2, depending on composition, particle size, and film thickness. A variety of printable discrete resistors with different sheet resistances, ranging from 1 ohm to 120 Mohm, processed on large panels (19.5 inches x 24 inches) has been fabricated. Low resistivity nanocomposites, with volume resistivity in the range of 10-4 ohm-cm to 10-6 ohmcm, depending on composition, particle size, and loading, can be used as conductive joints for high frequency and high density interconnect applications. The paper also describes a flexible technology for fine line structures. Several substrates including polyimide and LCP (liquid crystal polymer) were used in flexible technology for a laminate chip carrier and printed wiring board (PWB). The present process allows fabrication of traces having line widths narrower than 14 m.