Photosensitive Polyimides as Enabling Materials for Advanced Semiconductor Packaging

Abstract

Advanced packaging technologies have enabled electronic devices toward miniaturization, higher integration densities, and scalable optoelectronic applications. Among the key materials for low-dielectric redistribution layers, photosensitive polyimides (PSPIs) have emerged as a suitable candidate, owing to their combined capabilities in photo-patterning ability, mechanical strength, and low dielectric loss. However, recent research challenges the conventional view of performance trade-offs, demonstrating that molecular design and thermal management can be synergistically codesigned to enhance device performance. This review summarizes the latest advances in the molecular design of multifunctional PSPI design and highlights their integration into wafer-level packaging architectures. We focus on their role in promoting efficient heat dissipation from chip to external package and on reducing dielectric losses to improve signal integrity. Finally, future directions for PSPI-based materials are proposed, offering a forward-looking perspective for next-generation high-performance and flexible electronics.