Peridynamic Modelling of Process‐Dependent Material Strength in Additive Manufacturing

ABSTRACT

 Additive Manufacturing (AM) processes create complex, process‐dependent material properties during printing that cannot be measured in advance and are governed by parameters, such as tool path, temperature history and cooling conditions. A Peridynamics (PD) correspondence framework is presented for simulating the entire AM process chain—printing, cooling and mechanical loading—to predict the resulting material strength. Polymer crystallisation of Polyether Ether Ketone (PEEK) captured via a dual‐kinetic model is implemented as a subroutine compatible with the Abaqus HETVAL interface; the resulting crystallinity governs the local nodal stiffness. Thermo‐mechanical coupling with convective heat transfer is handled within the PD correspondence formulation. A matrix‐based quasi‐static solver is coupled with an explicit velocity‐Verlet integrator for the fracture phase to eliminate the Courant–Friedrichs–Lewy (CFL) bottleneck of purely dynamic integration. The framework is validated on PEEK dogbone specimens (ASTM D638) for four environment temperatures, demonstrating qualitatively correct crack initiation and propagation and a speedup exceeding two orders of magnitude over a fully dynamic reference computation.