P‐14.12: Research on the Mechanism and Key Factors of Rebound bubbles in AMOLED Curved Module

In the present study, an extensive experimental investigati on is conducted to elucidate the impact of various param eters, including product configuration of diverse modules, process variables, the type of Optical Clear Adhesive (O CA), the presence offoreign particles, and other pertinent factors, on the phenomenon of rebound bubbles. The find ings indicate that the utilization of an OCA with a higher loss factor and greater loss modulus, along with a flat cu rvature cover plate, significantly contributes to the mitigati on of rebound bubbles. The introduction offoreign particle s (e.g., metallic and silicone particles) tends to increase t he occurrence of defective rebound bubbles, necessitating stringent control during module fabrication and die‐cutting processes. While UV curing and pressure defoaming tech niques are observed to be effective in reducing rebound bubbles, increasing curing energy becomes ineffective onc e the curing rate exceeds a specific threshold. Conseque ntly, the UV curing energy must be meticulously selected in alignment with the specific curing rate requirements.