Optimization of High-Volume PCB Assembly: A Lean Six Sigma Approach Through Pin-in-Paste Technology Integration

The dual reliance on surface-mount technology (SMT) and pin-through-hole (PTH) assembly lines in high-volume printed circuit board (PCB) manufacturing induces logistical bottlenecks, excessive operational costs, and elevated thermal stress on components. This study presents the optimization of a wireless detector terminal production line by integrating Pin-in-Paste (PiP) technology within a Six Sigma DMAIC (Define, Measure, Analyze, Improve, Control) framework. By accurately calculating the required solder volume (Vreq) and stencil aperture dimensions based on pin and pad geometries, the wave soldering process was eliminated without altering existing thermal profiles. The integration consolidated the assembly into a single heat cycle, ensuring IPC-A-610 Class 2 compliance for barrel fill ratios. The results demonstrate a 97% reduction in average assembly costs, yielding annual savings of USD 92,513 while eliminating USD 44,025 in work-in-progress (WIP) inventory. Furthermore, the single-reflow approach mitigated component thermal degradation and reduced the facility’s carbon footprint by an estimated 13.32–17.76 metric tons of CO2 equivalent annually. This research validates a comprehensive methodology for transitioning to PiP technology, offering a sustainable, cost-effective framework for operational excellence in the electronics’ manufacturing industry.