DOI: 10.4071/001c.161498 ISSN: 2380-4505

Newly Developed Low-Transmission-Loss Multilayer Materials for PWBs Applied to High GHz Bands

Hikari Murai, Yasuyuki Mizuno, Hiroshi Shimizu, Makoto (Mak) Kato, Kenichi (Ken) Ikeda

The frequencies used to communication and process information have been extended beyond the GHz band to the microwave band to handle the growing volume of data. Signals on printed wiring boards (PWBs) used in these applications have come to adopt higher frequencies. At higher frequencies signal will attenuate more easily. It is getting important in high-frequency circuits to reduce the transmission loss on PWBs.

We have newly developed low-transmission-loss multilayer materials suitable for PWBs applied to high GHz bands. The new laminates made with new resin system have good dielectric properties and show the same level of low dissipation factor as the PTFE laminates. The transmission loss of the new laminate with our original profile-free copper foil is lower than that with VLP foils. These new laminates have proved to be reliable materials for good transmission. Moreover, they have high Tg, low moisture absorption, and good heat resistance suited for the lead-free soldering process.

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