Multifunctional ABS / CuS Nanocomposites Prepared by Solvent‐Free Melt Mixing: Enhanced Thermal, Dielectric, and Mechanical Properties

ABSTRACT

The inherently limited electrical, thermal, and mechanical properties of pure acrylonitrile‐butadiene‐styrene (ABS) restrict its use in flexible electronic systems and high‐performance devices. To address these limitations, this study focuses on the preparation of ABS nanocomposites reinforced with copper sulfide (CuS) nanoparticles, aiming to enhance their suitability for high‐performance and multifunctional applications. The nanocomposites were successfully developed using a solvent‐free melt mixing technique, ensuring environmentally friendly and scalable production. FTIR spectroscopy confirmed the successful insertion of CuS nanoparticles through the emergence of Cu–S vibrational modes and minor shifts in the characteristic absorption peaks, indicating strong interfacial interactions. FE‐SEM images indicated homogeneous dispersion of CuS throughout the ABS matrix. XRD patterns confirmed the presence of crystalline peaks of CuS within the polymer matrix. TGA analysis demonstrated a significant enhancement in thermal stability with increasing CuS content. The impedance analysis revealed that the nanocomposite with 7 wt% CuS exhibited optimal improvements in AC conductivity and dielectric constant, accompanied by a reduction in activation energy. The ABS/7 wt% CuS nanocomposite exhibited the highest tensile and flexural properties, surpassing those of pristine ABS by 60.8% and 30.8%, respectively. This study reveals an effective approach for expanding the functionality of nanoparticle‐reinforced ABS for next‐generation polymer‐based technologies.