Multi-Objective Optimization of Magnetic-Assisted Titanium Electropolishing in a Deep Eutectic Solvent Using Taguchi-TOPSIS Methodology
Eurison Jeyandra Tanamal, Asseghaf Bintang Ramadhani, Muhammad Fawwaz Kanziwa, Rizky Astari Rahmania, Kartika Nur ‘Anisa’, Chandrawati Putri Wulandari, Muslim Mahardika, Nor Hasrul Akhmal Ngadiman, Gunawan Setia PrihandanaTitanium and its alloys present machining challenges that necessitate post-machining surface finishing to guarantee functional reliability and surface integrity. Because traditional methods often rely on hazardous acidic media, recent sustainable manufacturing advances prioritize eco-friendly Deep Eutectic Solvents (DESs); however, achieving a balance between maximizing Material Removal Rate (MRR) and minimizing Surface Roughness remains a complex multi-variable optimization challenge. This study investigates the magnetic-assisted green electropolishing of titanium using a propylene glycol and choline chloride DES. A Taguchi L9 orthogonal array, Two-Way Analysis of Variance (ANOVA), and the Technique for Order Preference by Similarity to Ideal Solution (TOPSIS) were synergistically employed to evaluate the systemic interactions between applied voltage (6 V, 8 V, 10 V) and Agitation Modality (static, mechanical stirring, 0.5 T magnetic field). Two-Way ANOVA identified applied voltage as the statistically dominant parameter governing MRR (69.20% contribution), while demonstrating that surface roughness is significantly influenced by parameter interactions. Although TOPSIS mathematically balanced the competing numerical metrics, morphological SEM analysis confirmed that the synergistic combination of 8 V and a 0.5 T magnetic field achieved the optimal functional condition, yielding a featureless, defect-free 3D surface topography (Ra = 0.1610 µm). Ultimately, incorporating external magnetic field assistance effectively overcomes the mass-transport limitations of viscous DES media through controlled magnetohydrodynamic (MHD) convection, providing a robust methodology to balance high material removal efficiency with ultra-smooth surface integrity.