Multi-Components Integration in a SIP

Components with different nature and forms are more and more integrated in the reduced space of the SIP. To ensure the required operating performances, the management of the positioning of the last components in the package becomes a key step in the design flow. In this paper, some steps of the design, conception and manufacturing process of a SIP are proposed. The choice of the package, the electronic system configuration and the integrated components natures are treated by considering the final environmental constraint of the SIP. The cavity of the package is studied to appreciate perturbations phenomena’s that can reduce the SIP performances. Particular cavity comportment is studied in accordance with the positioning of a component. The impact of the presence and location of a QFN package in the environment is analyzed with the support of EM simulations to better understand the SIP implantation step.