DOI: 10.4071/001c.167758 ISSN: 2380-4505
Microstructural Characterization for Bottom Joint of Stacked Micro-via Integrated in a Substrate
K. Suganuma, M. Nishijima, M.-C. Hsieh, R. Okumura, H. Yoshida, C. Chen, A. Suetake, K. Yamanaka, H. Seto, Y. Kitahara, K. HashizumeThis Presentation focuses on Microstructural Characterization for Bottom Joint of Stacked Micro-via Integrated in a Substrate. This presentation addresses a Hidden threat : “Weak Micro Via”
Outline
1. Background of weak micro-via 2. Influence of e-less Cu growth on void formation 3. Observation of micro-via by STEM and APT 4. Summary