Micro-transfer printing of lithium niobate on 200 mm silicon photonics: A high-speed heterogeneous wafer-scale platform
Xiujun Zheng, Suzanne Bisschop, Arno Moerman, Margot Niels, Ewoud Vissers, Athina Papadopoulou, Philip Ekkels, Patrick Nenezic, Simone Atzeni, Elif Ozceri, Tiernan McCaughery, Ali Uzun, Ye Chen, Laurens Bogaert, Nishant Singh, Sandeep Seema Saseendran, Sofie Janssen, Natarajan Rajasekaran, Sadhishkumar Balakrishnan, Philippe Absil, Günther Roelkens, Bart Kuyken, Sarah Uvin, Maximilien BilletThe rapid growth of artificial intelligence and other data-center applications is driving the demand for photonic interconnects that combine high-speed with low energy consumption, making scalability a critical requirement. Micro-transfer printing has emerged as a promising technique for the wafer-scale heterogeneous integration of thin-film lithium niobate (TFLN) onto silicon photonics (SiPho) platforms. Here, we demonstrate heterogeneous SiPho–TFLN integration across four full 200-mm wafers with a 3σ placement accuracy down to 420 nm and a printing yield of >95%. Low insertion loss <2 dB over 600 phase modulators (forming 300 amplitude modulators) is achieved. A half-wave voltage of 4 V in a push–pull configuration and high-speed modulation with a bandwidth >70 GHz are demonstrated on a subset of tested devices.