DOI: 10.3390/cryst16070431 ISSN: 2073-4352

LTCC Ceramic Integration of an Ultra-Wideband High-Pass Filter Chip with Notch Suppression

Chengchao Lv, Xianglu Shan, Xinjiang Luo, Kaixin Song, Xiaopei Deng, Xuan Xie, Changwei Luo

This paper presents a miniaturized ultra-wideband high-pass filter integrated with a notch function based on low-temperature co-fired ceramic (LTCC). The design motivation is to realize continuous wideband high-pass transmission while rejecting a narrow in-band interference/leakage component in compact RF front-end modules. The proposed design employs a cascaded structure of a seventh-order quasi-elliptic HPF and a three-section λ/4 stub notch filter in a single multilayer LTCC chip. Multiple transmission zeros (TZs) are introduced to improve the lower-stopband selectivity, while the three-section coupled-line NF produces a tunable localized rejection band. The LTCC implementation further integrates multilayer capacitors, three-dimensional helical inductors, shielded strip-line coupling stubs, a grounding compensation capacitor, and an isolation wall to balance compactness, impedance matching, and parasitic suppression. The fabricated chip achieves an ultra-wide bandwidth of 2.35 octaves, a notch 20 dB FBW of 8.5%, an insertion loss below 2 dB, a 60 dB roll-off rate of 154.1 dB/GHz within the lower stopband, and a voltage standing wave ratio (VSWR) less than 2. Experimental results validate that the proposed compact chip meets communication requirements and is suitable for 5G base stations, radar systems, and other applications. The chip dimensions are 4.5 mm × 3.2 mm × 2.5 mm.

More from our Archive