Liquid‐Metal Interconnects: Proof‐of‐Concept for Repairable and Recyclable SiC MOSFET Chips
Nick Baker, Szymon Bęczkowski, Francesco Iannuzzo, Asger Jørgensen, Kjeld Pedersen, Kaichen Zhang, Stefan Meyer, Tauhidul HaqueABSTRACT
This paper demonstrates a proof‐of‐concept for repairing and reassembling SiC MOSFET chips enabled through the use of liquid–metal interconnects. All chip‐level interconnects (i.e., gate, drain, and source) on the SiC MOSFET are connected through liquid–metal. A liquid–metal packaged SiC MOSFET is subjected to 800 h of operation at a T J of 150°C. After this operating profile, the SiC MOSFET chip and all module components were separated and cleaned using isopropanol alcohol. The module was reassembled again using liquid–metal interconnects and subjected to a power cycling test in body‐diode mode at a Δ T J of 128°C, surviving 980k cycles. The module was again separated, cleaned, and reassembled. Another power cycling test in MOSFET mode was performed at a Δ T J of 82°C, surviving over 1.8 million cycles. The SiC MOSFET chip was still functional after this test.