DOI: 10.4071/001c.171425 ISSN: 2380-4505
Liquid Compression Mold Underfill (LCMUF): Optimizing the Flow-Warpage Trade-off for High-Density Fan-Out Advanced Packaging
Jack MeltonAI demand is driving fan-out packaging, bigger chips and tighter pitches. Conventional underfill and overmold materials are approaching their limits as AI chips begin to exceed 10x reticle size. This talk presents LCMUF (Liquid Compression Mold Underfill), a NAMICS material solution that merges gap-filling and overmolding into a single compression-molding step, cutting process time by ~70%. We’ll walk through the material science behind achieving narrow gap flow (less than 20 μm) via optimized filler size and loading, and low warpage via a flexible resin system — all without sacrificing reliability.