Iodine Capture with Copper-Electroplated Nickel Foams
Brian J. Riley, Harmony S. Werth, Steven Livers, Katherine R. Johnson, Brodie Barth, Miroslava Peterson, Ercan Cakmak, Chase Cobble, Martin Liezers, Nathan L. Canfield, Saurabh Kumar Sharma, Jie LianAbstract
This work explores the use of Ni0 foam scaffolds for Cu0 coatings for use as sorbents for iodine. The Cu0 electroplating was performed from aqueous copper(II) sulfate (CuSO4) solutions under different conditions to achieve a range of Cu0-layer thicknesses (4.89 ± 1.05 μm–57.32 ± 3.95 μm) with 900 A·m–2 current densities and coating times of 15–180 min. The thickest coatings resulted in Cu0-plated Ni0 foams with >89 mass % Cu0 in the final product. Iodine capture experiments showed very high Cu0 utilizations of 91.9–97.3 mass % at iodine loadings of 839–1774 mg·g–1 through the formation of CuI (marshite; space group F-43m). No evidence was found of iodine reactions taking place with the Ni0 scaffold, so it remained in iodine-loaded Cu-electroplated Ni foams as structural support to provide mechanical rigidity to the foams during the iodine loading process. Hot pressing of these materials can be used to create a CuI/Ni ceramic-metal composite waste form for disposal as demonstrated with spark plasma sintering.