DOI: 10.1039/d6ce00736h ISSN: 1466-8033
Interfacial growth and stress evolution of a thick Ta hydrogen-diffusion layer on nano-TiO 2 -supported Cu substrates
Yaru Wang, Fanxi Zhang, Chen Chen, Shixi Chen, Yaocheng Hu, Quanxu Jiang, Yupeng Xie, Sheng WangMicrometre-thick Ta hydrogen-diffusion layers on Cu substrates are difficult to stabilize, and this work employs nano-TiO 2 interlayers to tailor nucleation, promote lateral coalescence and mitigate stress accumulation during thick-film growth.