DOI: 10.1039/d6im00302h ISSN: 2755-2608
Interfacial Cu–O–Y bonding configurations govern CO 2 electroreduction pathways switching between CH 4 and C 2+
Jiaqi Feng, Jiaxin Cheng, Aofei Cheng, Panpan Gu, Zenghui Zhang, Xuejing Zhen, Qizhou Xue, Yanlin Wang, Min Wang, Shaojuan Zeng, Xiangping ZhangBy tuning the Cu/Y ratio in CuO/Y 2 O 3 , a low ratio forms Cu–O–Y coordination favoring CH 4 , whereas a high ratio creates a Cu–O–Y interface that lowers the C–C coupling barrier and boosts C 2+ products.