Interactions of Multiple Curved Cracks in an FGP Strip: Mixed Mode Analysis

ABSTRACT

This paper investigates multiple embedded curved cracks in a functionally graded piezoelectric (FGP) strip. In order to compute Mode I/II stress intensity factors (SIFs) and electric displacement intensity factor (EDIF), distributed dislocation technique (DDT) is employed. It is assumed that the mechanical properties vary exponentially along the thickness of the strip. Through the application of Fourier transform integration, the formulation is reduced to a system of Cauchy‐type singular integral equations. These equations are then solved numerically to determine the dislocation density on the crack surfaces, which serve to calculate field intensity factors. The DDT represents an effective approach for solving plane crack problems with high precision. It performs effectively even with complex crack geometries and systems comprising multiple curved cracks. Hence, the analysis developed in this study enables the consideration of an FGP strip with any number of curved cracks. The results have been validated by comparison with analytical solutions in other available papers. Numerical results focusing on the influence of the geometry of curved cracks, nonhomogeneity parameters, thickness of the strip, and interaction between cracks on field intensity factors.