Innovations in Die Side Capacitor Protection for Enhanced AI and HPC Performance

Advancements in semiconductor packaging are crucial to meet the rising demands of artificial intelligence (AI) and high-performance computing (HPC). In this context, Die Side Capacitors (DSCs) have emerged as a pivotal element within the packaging of CPUs and GPUs to maintain stable power supply and reduce noises to a minimum. Our work presents innovations in the field of DSC protection with a focus on LGA-based packages, as is mainly the case with CPUs, which play an important role in meeting today’s challenges in terms of efficiency, miniaturization and thermal management.