Hot Deformation Behavior and Process Optimization of the 6005A/ADC12 Composite Fabricated From Solid‐State Recycled Aluminum Chips

The hot deformation behavior and process optimization of a 6005A/ADC12 composite, fabricated via solid‐state recycling of mixed aluminum chips, were systematically investigated. Isothermal compression tests were conducted within the temperature range of 350–500 °C and the strain rate range of 0.01–5 s ⁻¹ . A strain‐compensated Arrhenius‐type constitutive model was established based on corrected stress–strain data, which exhibited excellent prediction accuracy ( R  = 0.997, AARE = 3.36%). Furthermore, processing maps based on the dynamic material model identified a safe deformation window of 460–500 °C and 0.06–0.31 s ⁻¹ . The microstructure evolution of the 6005A/ADC12 composite after hot compression was characterized and analyzed by EBSD. The results indicated that the microstructure of the ADC12 region was consistently dominated by dynamic recrystallization (DRX), with its grain size remaining relatively insensitive to temperature variations due to the pinning effect of Si particles. In contrast, the 6005A region exhibited a distinct dependence on deformation parameters. At a constant strain rate, increasing temperature accelerates dislocation slip and climb, causing dynamic recovery (DRV) to progressively dominate. However, with increasing strain rate, the rapid multiplication of dislocations promotes DRX as the primary softening mechanism. The grain size of the 6005A region increases markedly with rising temperature and decreasing strain rate. Moreover, the 6005A/ADC12 composite exhibited a pronounced strain gradient under high‐temperature and low‐strain conditions—a key mechanism enabling the simultaneous enhancement of strength and toughness in heterogeneously structured materials. These findings highlight the potential of heterogeneous microstructures in achieving balanced strength and ductility in recycled aluminum alloys, providing valuable guidance for the sustainable processing and industrial application of mixed‐chip composites.