Highly integrated, alignment healing, and full‐recyclable multifunctional flexible devices based on dynamic covalent bonds

Abstract

Integrated multifunctional flexible devices are essential technologies in intelligent sensing; however, their development is hindered by challenges such as unstable device interfaces, difficulties in precise damage repair, and limitations in material recovery. This study proposes a strategy of constructing functional layers alternately using crosslinked polymers with incompatible backbones but sharing the same dynamic bonds. This design utilizes identical dynamic covalent bonds to achieve strong interlayer bonding, approaching the strength of bulk materials. The incompatible backbones enable self‐alignment and precise healing of functional layers, while the dynamic bonds confer recyclability. Based on this approach, we successfully fabricated highly interface‐stable optoelectronic sensors incorporating nanospheres, conductive media, and magnetic particles. Following damage, these sensors self‐assembled under magnetic guidance and regained functionality after thermal treatment. Furthermore, the dynamically crosslinked polymer in the device dissolves upon heating, allowing for the complete recovery of both polymer and functional particles based on the distinct physical properties of the nanoparticles. This work simultaneously addresses the challenges of integration, repair, and recycling in flexible multifunctional devices through the design of dynamic bond materials, offering insights for their advancement.