High-Resolution Stereolithography-Based Printing of 3D Chip Packaging

3D printed microelectronics vision: Holst Centre’s new manufacturing technologies will enable next-generation microelectronics.

• Use additive manufacturing to do full 3D product build-up:

embedded chip/sensor components and electrical circuitry within free-form structural bodies.

• Our ambition is to show a fully scalable process:

equipment that can integrate bare-die and passive components with associated circuitry in a 3D form factor at high resolution.

• To enable new complex miniaturized electronic objects:

ultra compact electronic systems with minimal losses, and electronics seamlessly merged with other functional but non-electronic elements such as microfluidics.