DOI: 10.3390/ma19122655 ISSN: 1996-1944

High-Entropy Alloys: A Review of Emerging Sensing Materials for Next-Generation Flexible Electronics

Huatan Chen, Zhongyi Yu, Yang Huang, Bofeng Li, Fangting Feng, Yuming Jiang, Yuting Duan, Gaofeng Zheng, Zungui Shao

High-entropy alloys (HEAs), composed of five or more principal elements in near-equimolar ratios, have emerged as a groundbreaking class of materials for next-generation flexible electronics. This review systematically examines the unique potential of HEAs as sensing materials, moving beyond their traditional role as structural components. We first elucidate the fundamental mechanisms—core effects including lattice distortion, sluggish diffusion, and the cocktail effect—that endow HEAs with an exceptional synergy of high strength, good ductility, tunable electrical resistivity, and superior electrocatalytic activity. Subsequently, we critically analyze the state-of-the-art strategies for processing HEA-based micro/nano structures, including mechanical alloying, wet-chemical synthesis, and non-equilibrium deposition techniques, with an emphasis on their compatibility with flexible substrates. The core of the review categorizes and discusses the latest advances in HEA-based flexible sensors for strain/stress, gas, and electrochemical (e.g., glucose, biomarkers, heavy metals) detection, highlighting the structure–property–performance relationships. Representative studies have demonstrated that HEA flexible strain sensors achieve a temperature coefficient of resistance as low as 45.59 ppm/K with no signal drift over 6000 stretching cycles; room-temperature hydrogen sensors reach a detection limit down to 31 ppb with a response time of 19 s; and non-enzymatic glucose sensors deliver a sensitivity up to 3043 μA·mM−1·cm−2. Finally, we summarize the key challenges—such as manufacturing scalability, long-term stability under dynamic deformation, and cost-effectiveness—and provide a forward-looking perspective on promising research directions, including high-throughput compositional screening, multi-functional sensor arrays, and the integration of machine learning for rational material design.

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