Flexible, Robust Transparent Conductive Films With Excellent Electromagnetic Shielding Properties

ABSTRACT

Transparent conductive films (TCFs) are indispensable components for next‐generation wearable electronics, intelligent robots, and electromagnetic interference (EMI) shielding devices. However, the fabrication of conventional random metallic mesh suffers from an inherent trade‐off between “randomness and controllability”. Herein, we propose a synergistic strategy integrating organic crackle lithography, digital pattern extraction, and wet deposition to fabricate a large‐area, highly reproducible, and uniform random‐patterned flexible transparent conductive metallic mesh. By decoupling the mesh geometric parameters in three‐dimensional (3D) space, a 3D conductive network with high thickness is achieved. Remarkably, the structural decoupling endows the as‐prepared Cu mesh with an ultra‐low sheet resistance of 0.05 Ω ⁻¹ , an excellent transmittance of 90%, and a low haze of 1.18%, yielding a high figure of merit (FoM) of 69,814. Furthermore, the optimized transparent mesh delivers an outstanding EMI shielding effectiveness of 46 dB in the X‐band (8–12 GHz) alongside exceptional Joule heating capabilities. Additionally, from a topological perspective, the naturally cracked architectures possess better mechanical robustness than algorithmically generated random mesh, as the “T”‐type junctions structurally outperform the “Y”‐type configurations. This work has played a great positive role in promoting the application of flexible transparent conductive films in advanced photoelectric detection systems, intelligent manufacturing, equipment electromagnetic protection and other fields.