DOI: 10.1039/d6ra04171j ISSN: 2046-2069

First-principles evaluation of Janus TiMC MXenes as Cu interconnect barrier layers

Bowen Li, Zhiyong Li, Shuting Wang, Mingpeng Chen, Yanxin Qiao, Yao Xiang

First-principles calculations reveal that Janus MXenes (TiMC) outperform the traditional TaN diffusion barriers in Cu interconnects.

More from our Archive