Evaluation of the Ball Grid Array (BGA) Technology with a View to the Space-use Application

High-density mounting technique of components is greatly expected as one of the approach to high-speed signal processing and reduction in size and weight of components in the Space field of Japan. We evaluated the reliability of the Ball Grid Array (BGA) technology with a view to the Space-use application. For mounting the BGA package, study of nondestructive inspection procedure in solder, careful selection of boards and mounting materials aimed at improving the process quality, reviewing the countermeasures for the failures such as gap defect and volume defect, as well as vibration test, shock test, and thermal cycling test in mounted circuit board were performed. The study results and the test results for these above will be covered in detail here. We also studied the detection capability of the 4 different types of X-ray devices for the crack de-fect of mounted BGA and found that the 3 dimension X-ray CT device was the most effective for detecting the cracks. Furthermore, we will show the effectivity of the low thermal expansion underfill materials for shock resistance and vibration resistance.