Embedding the Footprint into Very High Frequency Surface Mount Components through De-embedding Optimization

As Multiple decade GHz RF applications become more common place mass production approaches these applications in component forms that require low cost production processes. These standard mass production processes include both LGA and BGA component mounting processes. Advanced design techniques are required to create successful implementations of component performance criteria including the PCB footprint. Through accurate die simulation and characterized interconnecting structures extended into the uniform transmission line environment of the PCB. A sufficiently predistorted die function can be achieved through simulated optimization with de-embedding components in line with the simulated device under test. This has been empirically demonstrated through many 20GHz plus passive filter structures. Furthermore these BGA footprints have demonstrated very stable performance and nesting tolerances are held low through strict surface mount manufacturing process definitions and controls.