Effect of Al 2 O 3 Atomic Layer Deposition on Fe Particles for EMI‐Thermal Management in Advanced Electronic Packaging
Yeon‐Ju Park, Hyunseung Yang, Ju Ho Lee, Hyunmi Kim, Myong Jae Yoo, Intae SeoABSTRACT
Dual‐functional hybrid particles were synthesized to simultaneously enhance electromagnetic interference (EMI) shielding and thermal dissipation properties. Based on Fe metal powders, conformal Al 2 O 3 thin films were precisely deposited on the particle surface via atomic layer deposition (ALD), employing H 2 O and O 3 as reactants to compare film uniformity and compositional differences. The Al 2 O 3 layer effectively increased the electrical resistivity of the metal powders by modulating defect states and inducing Al doping–associated band gap widening. These structural modifications contributed to improved thermal conductivity by facilitating efficient heat conduction pathways within the composite. Furthermore, the increased electrical resistance induced by the Al 2 O 3 film reduced shielding via reflection while enhancing electromagnetic wave absorption‐based shielding performance. This work demonstrates the fabrication of high‐performance EMI shielding/thermal dissipation particles applicable to semiconductor packaging, suggesting their practical utility for next‐generation high‐density electronic device integration.