Dynamic Thermal Relaxation in Metallic Films

The performance of low-temperature detectors utilizing thermal effects is determined by their energy relaxation properties. Usually, heat transport experiments in mesoscopic structures are carried out in the steady state, where temperature gradients do not change in time. Here, we present an experimental study of dynamic thermal relaxation in a mesoscopic system—thin metallic film. We find that thermal relaxation of hot electrons in copper and silver films is characterized by several time constants, and that the annealing of the films changes them. In most cases, two time constants are observed, and we can model the system by introducing an additional thermal reservoir coupled to the film electrons. We determine the specific heat of this reservoir and its coupling to the electrons. We suspect that multiscale thermal relaxation arises from the complicated morphology of the films, in which the electron–phonon coupling strength in grains with different orientations varies.