DOI: 10.1039/d6ta05113h ISSN: 2050-7488

Double-network interlocking and chemical riveting: unlocking the heat resistance-toughness paradox in advanced epoxy resins for electronic packaging

Xinle Zhang, Tiandong Zhang, Chao Yin, Changhai Zhang, Qingguo Chi
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Dual-network interlocking-chemical riveting strategy enables high-temperature resistant and high-toughness epoxy resins for electronic packaging.

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