DiaCool Embedded IMA

Efficient thermal management is a necessity for nearly all electronic applications. It is more critical than ever. As the size of electronics shrinks while power density increases, legacy materials often generate hot spots because of insufficient cooling, leading to drop in performance. Ultrahigh performance thermal spreaders made with DiaCool easily adapt to any design. They are an effective solution for enhancing product reliability in power, RF packaging and laser diode submounts. Dia Cool , a metal-diamond composite material, delivers a device-friendly co-efficient of thermal expansion (CTE) and very high thermal conductivity. As such, it can satisfy the most demanding high power density applications. DiaCool exhibits excellent surface quality for all of your die attach and soldering needs. And , it is easily adaptable to customer-specific designs, making it a cost-effective solution for increasing the long term reliability of power , RF and laser diodes and for any applications were thermal management is vital for longevity. DiaCool is available in an aluminum , copper diamond or silver diamond matrix that can be coated or plated with a variety of metals to meet specific requirements. The material is manufactured in a sandwich like structure, with the composite material located between layers of pure aluminum, copper or silver. It can be used for heat sinks, die tabs, and heat spreaders, and it provides a significant advantage over more conventional laminate or MMC materials. Typical DiaCool Material compositions such as AG850 , AG700 , CU600 and AL500 can ideally achieve 850 W/mK , 700 W/mk , 600 W/mk and 500 W/mk respectively. The work done in this paper will show the various experimental package level integrated DiaCool performance test results in a test specimen for evaluation. The test IMA platform can be customized to a specific active device applications. The paper will also show the latest acceptance and solution build up by industry for optical devices applications.