DOI: 10.4071/001c.116998 ISSN: 2380-4505

Cu Interconnect Scaling with Hybrid Bonding for 2.5 and 3D Integration

Thomas Workman, Guilian Gao, Gabe Guevara, Cyprian Uzoh, Gill Fountain, Jeremy Theil, Dominik Suwito, Laura Mirkarimi

Abstract not available for Cu Interconnect Scaling with Hybrid Bonding for 2.5 and 3D Integration

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