Crack-Free Copper Alloy Coating on Aluminum Alloy Fabricated by Laser Cladding

Crack-free Cu alloy coating has been fabricated on Al alloy substrate with the existence of a Ag buffer layer. The Cu alloy coating had 12 at.% Al and 45 at.% Ag, which contributed to the formation of Cu solid solution and the eutectic phase (transformation temperature 780 °C). The eutectic phase was characterized as finer Cu solid solution and finer Ag solid solution. The Ag buffer layer had the main contents of Ag2Al and Ag solid solution, and it not only hindered the formation of brittle intermetallic compounds (IMCs)but also reduced the thermal stress as its intermediate coefficient of thermal expansion (CTE). Furthermore, the plastic deformation of Ag solid solution in the Ag buffer layer and Cu solid solution in Cu alloy coating also relieved the thermal stress which was generated during the cladding process. All these three aspects inhibited crack generation. And the hardness of the Cu alloy coating increased to approximately 275 HV due to the strengthening effect of Al solid solution, grain boundary within the finer eutectic phase, and nano twin in the Cu solid solution of the eutectic phase.