Convective heat transfer in corrugated Diamond triply periodic minimal surfaces with sinusoidal flow perturbations

To enhance the heat transfer performance of compact heat-dissipation structures under forced air cooling, this study proposes a novel periodically corrugated V-Diamond triply periodic minimal surface (TPMS) configuration (TPMS1–TPMS5), addressing limitations of conventional corrugated fins and classical Diamond TPMS structures in balancing heat transfer enhancement and flow resistance. Numerical simulations combined with experimental validation were conducted to systematically compare the flow characteristics, heat transfer performance, and overall convective behavior of the proposed structures. The results show that, compared with the classical Diamond TPMS, the V-Diamond structure modifies the spatial phase distribution of the implicit-surface isosurfaces, forming periodic local contraction–expansion regions within the flow channels. These features induce transverse pressure gradients, secondary flows, flow separation and reattachment, and near-wall high-shear regions, thereby enhancing fluid disturbance, promoting fluid mixing, and periodically disrupting and reconstructing the thermal boundary layer. Consequently, convective heat transfer is significantly improved. TPMS5 exhibits the highest inlet–outlet temperature difference, convective heat transfer coefficient, and Nusselt number, with a heat transfer coefficient 20.02% higher than that of the classical Diamond structure, exhibiting the strongest heat transfer enhancement capability, but with the largest pressure drop and friction factor. TPMS5 is most suitable for scenarios with extreme heat dissipation requirements. TPMS2 provides the optimal balance between heat transfer enhancement and flow resistance, giving the best performance evaluation factor j/f, 21.90%–36.69% higher than that of the classical Diamond structure. Overall, the V-Diamond TPMS shows strong potential for high-performance electronic cooling, compact heat exchangers, and advanced thermal management systems.