DOI: 10.3390/photonics13070647 ISSN: 2304-6732

Comparative Study of the O–U-Band Transmission Performance of Different Optical Fiber Links Based on the GN Model

Bingyan Shan, Jingyang Tian, Xiaojian Li, Qianle Huang, Mengfei Huo, Bing Lei

As the available spectrum in the conventional C band becomes increasingly limited, ultra-wideband transmission across the O–U wavelength range (1260–1675 nm) provides a promising approach to increasing optical fiber link capacity. To support performance evaluation and preliminary fiber-link selection, this study compares standard single-mode fiber (SMF), pure-silica-core fiber (PSCF), and hollow-core fiber (HCF) links across the O–U bands. A transmission-performance analysis framework was established based on the Gaussian noise (GN) model. Band-specific amplifier parameters and fiber-specific span configurations were incorporated to evaluate transmission reach, optimum launch power, and theoretical capacity. Auxiliary simulations were conducted using VPIphotonics Design Suite 11.1 (VPIphotonics GmbH, Berlin, Germany) for representative C-band cases to examine the consistency of the overall trends predicted by the theoretical analysis. The GN-model analysis and auxiliary simulations show consistent overall trends, indicating that the GN model can serve as a computationally efficient tool for comparative link assessment and preliminary fiber-link selection. Under the unified analytical framework and consistently defined engineering constraints, PSCF offers a clear transmission-reach advantage over conventional SMF, whereas HCF shows greater theoretical power tolerance and capacity potential under the adopted representative parameter assumptions. Under the adopted non-saturated reference operating conditions, the per-channel capacity of HCF is approximately 34–54% higher than that of SMF in the S, C, L, and U bands and also clearly exceeds that of PSCF. These HCF results should be interpreted as model-based theoretical estimates, since practical performance may be affected by loss, dispersion uncertainty, splice/connector loss, bending sensitivity, and mode coupling.

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